MG Chemicals 4901-227G SN99 1/2Lb Lead Free Solder MF

M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. If your products might enter Europe, you must ensure they are RoHS compliant now. If your products are sold in California, you must ensure they are compliant by January 1, 2007. Products containing lead solder will not comply. Features

• Lead freeComplies with RoHSExceeds the impurity requirements of J-Std-006No Clean flux21 Gauge, 0.032" diametersExcellent wettabilityHard non-conductive residues

Flux Percentage: M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.Flux Core: A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.